We are also able to develop the execution of reverse engineering (reverse engineering) which takes place through the reconstruction of the mathematical model of the surfaces and internal volumes.

The system is suitable for tomography applications where a resolution of 20 μm is sufficient, which include:

• Analysis of internal defects (porosity, shrinkage, cracks)
• Study of a product in tomography; comparison with 3D CAD mathematics to assess deformation induced by manufacturing processes or to study assembly criticality
• analysis of the internal components, as a preliminary action to a Failure Analysis in case of failure or breakage
• Analysis of the thickness and geometry inside the component;