In the industrial sector it can happen that a product or an industrial component is “defective”, in this case it is necessary to define an approach of analysis of the fault through the analysis of the internal components to prevent it from breaking. This specific analysis is the so-called failure analysis, whose usefulness is precisely that of identifying the cause of the fault.
Normally this analysis is based on a destructive approach: the component is opened and the affected area is identified for further investigation. The diagnostic techniques used in our laboratory make use of optical and electronic microscopy and are also essentially based on the preparation of a sample by microscopy; which results in the destruction of the real component.
The tomography allows us to analyze potential causes of failure without damaging the component.
Analysis of a short circuit, a pinched O-ring, an incorrectly fixed thread, a melted thermal sensor, an inappropriate level of lubricant; All typical aspects of critical operation that can be easily detected in tomography before proceeding to the opening of the component.
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